噻唑啉基二硫代丙烷磺酸钠 SH110(CAS: 8106-00-1)

1. It is used in acidic copper plating and can refine grain size, improving the leveling and hardness of the plating layer. 2. It is used in decorative and functional electroplating, and is applied in hardware copper plating, electroforming of copper, printed circuit boards, and the lithium-ion battery copper foil industry. 3. It can significantly improve the tensile strength of the copper foil in the lithium-ion battery copper foil electroplating process.